All our products are 100% french manufacture.
We call on subcontractors partners for :
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SYNTHESIS OF OUR MANUFACTURE ORGANISATION
Mechanical machining ► Full subcontracting
Thick Film technology ► On our Site
Thin Film technology ► Prototyping on site
Printed circuits ► Prototyping on site
Lumped elements ► On site or subcontracting
FACILITIES AND INDUSTRIAL EQUIPMENT
Simulation tools, Computer assisted design and drawing
CAD and Solid Modeling Design Stations
In-House Engineering Simulation Tools
Electromagnetic simulation softwares: Ansoft HFSS, Ansoft Designer, Ansoft Optimetrics,
3D CAD softwares: Solid Edge
Calculation and programming softwares
RF and microwave design software: Genesys
PCB design software
In-House Thick film Technology production unit
Class 10,000/1000 Clean RoomScreen insolators
Screen-printing machines - BACCINI Screen-printing dryers 150° - DEK 1100°C ceramic firing oven (4 zones) - PCE
Other industrial equipment
Cutting and drilling: C02cutting lasers, YAG laser
Drying and Curing Ovens
Automatic Thermosonic wedge wire bonder - F&K DELVOTEC
Soldering stations
Optical and Metrological equipment
Measure scope – NIKON
Binocular microscopes - NACHET
Film Thickness controller - ZEISS
Environmental simulation testing
Temperature Cycling Chambers (rapid temperature cycling)
Humidity Testing
Gross Leak Testing
Electronic Tests and Measurements
Vector Network Analyzers 10 Hz to 40 GHz – AGILENT & ANRITSU
Spectrum analyzer 10Hz – 26.5 GHz – AGILENT & ANRITSU
Synthesized signal generator 250 KHz - 20 GHz - AGILENT
Scalar analyzer 2 – 20 GHZ - AGILENT
Waveguide Harmonic Mixer 33GHz to 50GHz – AGILENT
Noise source, 10 MHz to 18 GHz - AGILENT
RF and DC Power Testing
EXAMPLES OF OTHER MANUFACTURING SERVICES
Our production unit is not only dedicated to manufacture our own products.
CONTRACT MANUFACTURING SOLUTIONS FOR COMPONENTS AND ASSEMBLIES
On customers’ drawing basis, we can act like a subcontractor in the management of a whole production. We make our expertise as a manufacturer available to our customers in order to:
- manage the process of industrialization of a prototype yet designed;
- improve an existing design and set up the batch production following the objective of a most effective cost and/or specifications.
We can implement the following technologies:
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THICK FILM TECHNOLOGY MANUFACTURE
The use of ceramic printed circuit boards offers many advantages over conventional electronic printed circuit boards (PCB) as the thermal conductivity of ceramics is far superior
to that of PCBs.
Our facilities in thick film technology are used, on the one hand, for manufacture of our proprietary products (filters, power loads, mixers....) sold as individual parts or integrated in other modules we manufacture.
On the other hand, we design and mass produce Thick Film Hybrid Circuits on Alumina (Al2O3) and on Aluminium Nitride (AlN) on complex geometry substrates, also provided with laser made metal coated pass-thru holes. Alumina substrate high thermal and mechanical stability is extremely suitable for chip & wire components. Production can also be done according customers’ production records.